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products

Solder Wire

LFS-604(Sn-3.0Ag-0.5Cu)
Flux contents：3.5%
Diameter(mm)：0.3, 0.38, 0.5, 0.65, 0.8, 1.0, 1.2, 1.6　　

Features
　・Good wettability of solder
　・ Short soldering is less likely to occur
　・Less burnt to the soldering tip, Less damage to the tip
　・Less solder Balls and Flux spattering、Good apperance
　　after soldering.
　・Excellent solderability at around320 degreestip temperature
　　(Depends on heat capacityof the soldering point)

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LFS CS-Plasoft(Sn-3.0Ag-0.5Cu)
Flux content：2.5%
Diameter(mm)：0.3, 0.38, 0.5, 0.65, 0.8, 1.0, 1.2, 1.6

Features
　・flux residue will not be crack and peeling
　・Water resistance and heat resistance are good
　　also less flux spattering
　・suitable for soldering with close contact point,
　　 also automotive-related products
　

Solder paste

MST-LF921P

Flux content:　11.0%
particle size　 　 　： 20-38μm

Features
　・Good for printing
　・without bridge after reflow.
　・Also without solder balls after reflow
　・without shift the component, tombstone

※Any other inquiries please contact us. we will customize solder paste for customer